Thin-Fin™ Heat Sinks For computers and custom applications
reduce package case temperature by as much as 20ºC.
These flexible, copper spreaders attach to the electronic
package using pre-applied adhesive, providing an off-theshelf solution for PCI and AGP chip sets. A laminated
dielectric coating prevents shorting, making the Thin-Fin
ideal for BGA devices and multimedia applications.
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341600F00000G 、 341700F00000G 、 341800F00000G 、 341900F00000G 、 342000F00000G 、 342100F00000G |
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[ Graphics Processors ][ FPGA’s ][ Embedded Processors ][ DSP’s ][ Any device using a BGA, PGA, or a QFP package ] |
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Datasheet |
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UL 94V-0 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/01/17 |
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529 KB |
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