TAZ Series CWR19 - MIL-PRF-55365/11 Established Reliability, COTS-Plus & Space Level
2019-08-18
An extended range of capacitor ratings beyond
CWR09 that is fully qualified to MIL-PRF55365/11,
this series represents the most
flexible of surface mount form factors, offering
nine case sizes (the original A through H of
CWR09) and adds the new X case size.
The molded body / compliant termination
construction ensures no TCE mismatch with any
substrate. This construction is compatible with a
wide range of SMT board assembly processes
including wave or reflow solder, conductive
epoxy or compression bonding techniques. The
parts also carry full polarity and capacitance /
voltage marking.
The four smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge
options (“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
CWR09 that is fully qualified to MIL-PRF55365/11,
this series represents the most
flexible of surface mount form factors, offering
nine case sizes (the original A through H of
CWR09) and adds the new X case size.
The molded body / compliant termination
construction ensures no TCE mismatch with any
substrate. This construction is compatible with a
wide range of SMT board assembly processes
including wave or reflow solder, conductive
epoxy or compression bonding techniques. The
parts also carry full polarity and capacitance /
voltage marking.
The four smaller cases are characterized by their
low profile construction, with the A case being the
world’s smallest molded military tantalum chip.
The series is qualified to MIL-PRF-55365 Weibull
“B”, “C”, “D” and “T” levels, with all surge
options (“A”, “B” & “C”) available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
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