TAZ Series CWR09 - MIL-PRF-55365/4 Established Reliability, COTS-Plus & Space Level
2019-08-18
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MILPRF-55365/4,
and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or compression
bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MILPRF-55365/4,
and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or compression
bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF55365).
In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
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