Tflex™ 600 Series Thermal Gap Filler
conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron
nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal
resistances.
Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal
performance. Tflex™ 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94
V0 rating.
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[ Cooling components to the chassis or frame ][ High speed mass storage drives ][ RDRAM memory modules ][ Heat pipe thermal solutions ][ Automotive engine control units ][ Telecommunications hardware ] |
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Datasheet |
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UL 94 V0 |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/08/21 |
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231 KB |
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