VINcoE3-21M-*-PD

2022-04-14

●Specifications for Printed Circuit Boards
■PCB thickness must not be less than 1.6 mm
■PCB material should comply with IEC 61249-2-7
■Both sides of the PCB should be covered with solder mask
■Plated through-hole specifications for Press-fit pins:
▲Plated hole final diameter: Ø1 mm +0.09 mm / 0.06 mm
▲Thickness of the Cu PTH wall > 25 μm Cu
▲Minimum Cu land width > 0.2 mm
▲Through hole position accuracy: ±0.1 mm
▲Chemical Tin (Sn) plating: 0.5 μm to 10 μm
▲HAL Tin (Sn) plating: 0.5 μm to 50 μm
▲Chemical Gold (Au), Silver (Ag) and Organic Solderability Preservative (OSP) are not generally released
▲Minimum distance between the centre of the pin hole and the edge of the PCB or components on the PCB: 4 mm
▲For additional requirements the IEC 60352-5 standard should be considered
■Hole and cutout sizes on the driver PCB

Vincotech

VINcoE3-21M-*-PD

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Power module

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18.10.2016

Rev. 01.1

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