Fabrication Notes RO4360G2™ Laminates Circuit Processing Guidelines

PublishTime：2020-11-12

These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4360G2™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.

Brand of Product：	ROGERS
Part#：	RO4360G2™ More Part#
Product Category：	Laminates Circuit More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2017/08/02
Version Number：	Revised 1122
Data Encoding：	Publication #92-501
Data Size：	97 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 4 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits