RO4360G2™ Laminates Circuit Processing Guidelines

PublishTime：2018-01-16

These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4360G2™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.

Brand of Product：	ROGERS
Part#：	RO4360G2™ More Part#
Product Category：	Laminates Circuit More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2017/08/01
Version Number：
Data Encoding：	Publication #92-501
Data Size：	97 KB

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Integrated Circuits