PRODUCT/PROCESS CHANGE NOTICE (PCN) PBGA package family A-0309-05
●Product Affected:PBGA package family(see attachment for affected part #s)
●IDT has qualified the PBGA package family using new mold compound Sumitomo EME-G770 series and a new die attach material Ablestik 2300. This notification is to advise our customer of qualification and addition of new assembly materials. The new mold compound and die attach material can meet 260ºC peak reflow temperature requirements. Please see attachment for qualification data and additional details.
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PCN/EOL |
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Please see the document for details |
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PBGA |
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English Chinese Chinese and English Japanese |
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1/6/2004 |
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REV. 00 |
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391 KB |
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