IDT Wafer Dicing Guidelines
● This guideline describes the requirements for dicing wafers manufactured by IDT. It applies to both IDT internal sawing operations and to sawing procedures used by customers purchasing un-sawn wafers. Failure to follow these guidelines could result in lower yields and immediate or delayed operational failures including data loss – particularly failures related to EEPROM data retention.
● Disclaimer: These dicing practices are industry standard norms. IDT is not responsible for issues related to dicing performed by wafer sawing service providers; it is the responsibility of the customer or subcontractor to ensure adherence to industry standards.
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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April 1, 2016 |
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Revision 1.10 |
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265 KB |
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