IDT® Thermal Device Analysis and Design Considerations Application Note 80B8030_AN002_03 August 5, 2009
●Overview
■IDT offers a large selection of semiconductor products in a variety of packages. Each device may require a different thermal solution depending upon the application, board size, and system thermal requirements. In some cases, a heat sink may be required to maintain junction temperatures at, or below, specified maximum values.
■When using a heat sink it is important that attachment techniques and thermal requirements be critically analyzed to ensure reliability. Factors to be considered include: surface preparations, selection of thermal interface materials, curing process, shock and vibration requirements, and thermal expansion coefficients.
■The analysis and formulas in this document can be used for any IDT device, however the Serial RapidIO Switch Tsi57x (which includes both the Tsi574 and Tsi578) has been chosen as an example for thermal analysis.
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Application note & Design Guide |
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Please see the document for details |
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FCBGA |
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English Chinese Chinese and English Japanese |
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August 5, 2009 |
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80B8030_AN002_03 |
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