FULLY AUTOMATIC DICING MACHINE

2025-03-19
Tokyo Seimitsu's fully automatic dicing machine is designed for Φ200 mm wafers, featuring a twin dicing concept with two opposing spindles for space-saving and high maintainability. The machine is equipped with a high-performance, high-power spindle and offers enhanced productivity through its gate-shaped structure and X, Y, and Z-axis servo motors. The user-friendly 17-inch touch panel and GUI make operation comfortable and efficient. The AD2000T/S model combines advanced fluidics, mechatronics, and energy conservation techniques, contributing to the success of the semiconductor industry.

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AD2000T/S

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Fully Automatic Dicing Machine

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Semiconductor Industry ]

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Selection guide

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