Polish Grinder

PublishTime：2025-03-19

Polish grinder PG3000RMII is an integrated system equipment for ultra-thin wafer production. It achieves ultra-thin processing through integrated processes such as polishing from grinding to stress relief. The equipment combines a stable conveying system and a specific application/protection tape stripping mechanism for thinning, which helps to stabilize thinning production. In addition, Accretech can propose the best application for integration with EGF and ML cutting systems, which provide gettering effects.

Brand of Product：	ACCRETECH
Part#：	PG3000RMII More Part#
Product Category：	Polish Grinder More
Application：	[ ultra-thin wafer production ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：
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Data Size：	647 KB

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