Non-Silicone Thermal Conductive Putty

PublishTime：2025-03-18

LiPOLY N-putty2-s系列是一种无挥发低分子硅氧烷的非硅热导材料，具有低总挥发性气体。其热导率为5.0 W/m\*K，高变形性能可以完美填充微小空气间隙，消除公差。它还能克服溢出和干燥问题，提高热导率，非常适合用于点胶机器人。

Brand of Product：	日宝立电子
Part#：	N-putty2-s More Part#
Product Category：	热导膏 More
Application：	[ CPU与散热器之间 ][ 组件与散热器之间 ][ 高速大容量存储驱动器 ][ 电信硬件 ][ 平板显示器 ][ 机顶盒 ][ IP摄像头 ][ 5G基站及基础设施 ][ 电动汽车 ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	30ml、55ml、330ml的推管，1kg、25kg的桶装
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	338 KB

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