N-putty-s Non-Silicone Thermal Conductive Putty

PublishTime：2024-09-27

●LiPOLY N-putty-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 3.5 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It can also overcome spillage and drying issues to increase thermal conductivity, making it ideal for dispensing with dispensing robots.
●FEATURES
■Thermal conductivity:3.5 W/m*K
■Bond line thickness:100-1500μm
■Non-silicone resin materials
■Designed to remove manufacturing tolerances
■Does not produce stress on delicate components
■No vertical flow
■Dispensable for serial manufacture
■For any high compression and low stress application

Brand of Product：	东宝立电子
Part#：	N-putty-s 、 N-putty-s series More Part#
Product Category：	Non-Silicone Thermal Conductive Putty 、 non-silicon thermally conductive material More
Application：	[ High speed mass storage drives ][ Telecommunication hardware ][ Flat-panel displays ][ Set-top box ][ IP CAM ][ 5G base station ][ infrastructure ][ EV electric vehicle ][ dispensing robots ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2024/6/5
Version Number：
Data Encoding：
Data Size：	340 KB

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