FDLV18 C75 Dispensable Gap Filler

2025-03-18
FDLV-18 是一种基于2K硅橡胶的溶剂型间隙填充液体,具有1.8 W/mK的热导率、15 kV/mm的电击穿强度和小于7000 mPas的粘度。与其他间隙填充液体相比,其粘度仅为十分之一,因此材料“流动如水”,具有自流平和填充每个角落的优点。
C75 Dispensable Gap Filler 是一种石墨片材料,具有绿色/白色,基于硅酮,混合比例为1:1,固化温度为25°C,1小时。

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FDLV18C75

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间隙填充液体石墨片材料

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间隙填充 ]

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