FN13 High Thermal Conductivity Gap Filler - C75 High Thermal Conductivity Gap Filler

PublishTime：2025-03-18

FN13和C75是两种高热导率间隙填充材料，主要用于在PCB和散热器或金属外壳之间提供电绝缘和热传导。它们基于硅酮软垫和玻璃纤维增强材料，具有优异的耐穿刺、剪切和撕裂性能。这些材料适用于-40°C至200°C的工作温度范围。

Brand of Product：	THAL
Part#：	FN13 、 C75 More Part#
Product Category：	高热导率间隙填充材料 More
Application：	[ PCB和散热器或金属外壳之间的填充 ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	玻璃纤维增强硅酮软垫
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	740 KB

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