Package Foundry Trial Production of FOWLP, WLCSP, etc.
■Features
●Maxell‘s Package Foundry specializes in high mix low volume production of FOWLP and WLCSP.
●We provide Cu rewiring package fabrication by utilizing both technologies semiconductor front-end process and plating.
●We also have experience in packaging compound semiconductors such as SiC and GaN other than silicon.
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Technical Documentation |
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Please see the document for details |
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FOWLP;WLCSP;MCP |
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English Chinese Chinese and English Japanese |
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June 2024 |
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2.4 MB |
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