Stencil
We offer various stencils with Maxell’s electroforming technology such as for micro solder ball placement, for printing, for vapor deposition and COB. Regarding the stencil for micro solder ball placement, we have experiences that have placed phi 50μm and smaller micro solder ball by using special structured stencil.
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2016 年 4 月 |
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714 KB |
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