Product Samples ATP1016: Epoxy No Bleed Metallization
●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.
●TaN/TiW/Au metalization on Aluminum Oxide (Al203). ATP offers a proprietary Gold metalization scheme that reduces epoxy bleed out during assembly. This process is wire and ribbon bondable.
●ATP1016: Material is 15 mil As-Fired Al2O3
■TaN Resistors = 50 Ohms per Square
■TiW = 400–800 Ångströms
■Au = 120μ" minimum
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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200521 |
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Version 200521 |
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431 KB |
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