Product Samples ATP1014P: Plated (Au/Sn); ATP1014S: Sputtered (Au/Sn)
●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.
●ATP custom fabricates thin film submounts for laser diode applications. These submounts can include predeposited and patterned Gold Tin (Au/Sn) that is Sputtered(S) or Plated(P) to accommodate low cost, high volume, automated assembly of laser diode modules. The use of predeposited and patterned Au/Sn replaces the more traditional approach of using Au/Sn Preforms. The Au/Sn will have accurate placement and dimensions. The thickness is tightly controlled. Multiple Au/Sn locations can be patterned on the circuits without additional cost. The accurate, thin Au/Sn thicknesses aid in the laser attachment and alignment resulting in less assembly time and better yields. ATP’s standard alloy composition is 80% Au and 20% Sn and reflows at 284℃.
●Typical Sample Metalization
■TiW/Au/Ni/Au/Sn
■TiW = 400 –1,000 Ångströms
■Au = 3 microns
■Ni = 500 –1,500 Ångströms
■Au/Sn = 5 microns
■Custom metalizations and thicknesses available upon request.
●Pre-deposited and Patterned Au/Sn Guidelines
■Smallest Feature Size: 0.002" x 0.002" (5.08μm x 5.08μm)
■Minimum Pitch (Minimum space between Au/Sn Pads): 0.002" (5.08μm)
■Typical Au/Sn Thickness: 160μ"–200μ" (4– 5 microns)
■Minimum Au/Sn Thickness: 80μ" (2 microns)
■Maximum Au/Sn Thickness: 400μ" (10 microns)
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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200521 |
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Version 200521 |
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