Ryzen Direct Die Frame V2
■With the Ryzen Direct Die Frame V2, Thermal Grizzly is expanding the compatibility of the Ryzen 7000 Direct Die Frame to include additional processors in response to the production changes that AMD has introduced with the Ryzen 7000X3D processors. It should be noted that the Ryzen Direct Die Frame V2 is not compatible with the Ryzen 8000G series processors. An up-to-date list of all verified compatible processors is available online.
●What are the advantages of "direct die" cooling of the CPU?
■Intel and AMD processors are supplied with a heat spreader on the CPU. This heatspreader is made of copper, which has good thermal conductivity, and protects the CPU's silicon chips from damage. At the same time, it distributes the waste heat from the CPU die over a larger area so that it can be transferred more efficiently to the CPU cooler.
■In the case of AM5 processors, the heatspreader is not only comparatively thick, but also has a relatively small contact surface due to the shape of the heatspreader. To avoid this, the heatspreader can be replaced with a suitable upgrade heatspreader or omitted directly. In both cases, the CPU must first be "delidded".
■A CPU is mainly delidded in order to
eplace the thermal interface material (TIM) between the CPU die and the heatspreader,
▲replace the thermal interface material (TIM) between the CPU die and the heatspreader,
▲replace the heatspreader or attach the CPU cooler directly to the CPU die.
■Please note that delidding the processor is at your own risk and will void the processor's warranty! To use the Ryzen Direct Die Frame V2, the Socket Actuation Mechanism (SAM) must be removed, which may invalidate the manufacturer's warranty of the motherboard.
●Short informations
■Extended compatibility, including Ryzen 7000X3D
■CPU compatibility list available online
■Enables mounting of delidded Ryzen CPUs
■Only for delidded CPUs! Attention: Loss of warranty!
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