HPE ProLiant ML30 Gen11 Server Data sheet
■Hewlett Packard Enterprise recognizes the imperative to help minimize our environmental footprint and it is a core part of our strategy. The product carbon footprint (PCF) sums up the total greenhouse gas (GHG) emissions generated over the product's lifecycle. The product lifecycle includes manufacturing, transportation, use, and end of life.
■This PCF uses Product Attribute to Impact Algorithm (PAIA) version 1.4.0 for manufacturing and end-of-life GHG emissions. PAIA is a streamlined lifecycle assessment (LCA) tool developed by the Massachusetts Institute of Technology's Materials Systems Laboratory.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/6/18 |
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a00140774ENW |
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425 KB |
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