2-pack solder resists of the series Elpemer® 2469 SM-HF Technical Report
●General information
■The solder resists of the series Elpemer® 2469 SM-HF are solder masks in the sense of VDI/VDE 3710, sheet 4: "Fabrication of printed circuit boards; printing processes". They are permanent solder masks that are applied to those parts of the printed circuit board which are not to be tinned during subsequent soldering processes. The photoimageable 2-pack solder resists of the series Elpemer® 2469 SM-HF are suitable for all common application processes and developed in polyalcohols (butyl carbitol or carbitol).
●green transparent
●suitable for all common application processes
●photoimageable
●highest resolution even of finest details (e.g. 50 μm)
●polyalcohol developable
●halogen-free acc. to JPCA-ES01-2003/IEC 61249-2-21
●excellent permanent temperature resistance at 150 °C [302 °F]
●thermal cycling resistance:
■-40 up to +150 °C [-40 up to 302 °F]
■-65 up to +125 °C [-85 up to 257 °F]
●excellent resistance to galvanic and electroless nickel/gold (ENiG), palladium, silver, tin baths and OSP processes (Organic Solderability Preservative)
●compatible with lead-free soldering processes
●fulfil/exceed among others
■UL 94 V-0, UL File No. E80315
■IPC-SM-840D, Class H and T
■Siemens SN 57030
■Bosch Y 273 R80 029
■NASA outgassing test acc. to ASTM E595
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GL 2469 SM-HF 、 SD 2469 SM-HF 、 2469 SM-HF 、 Elpemer® 2469 SM-HF |
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2015/2/18 |
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274 KB |
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