Plugging pastes of the series SD 2361 Technical report
●The plugging pastes of the series SD 2361 are applied to seal via holes for vacuum adaption during incircuit testing, thus preventing solder from seeping through to the component side and flux agents from settling in the holes.
■Application by screen printing
■thixotropic adjustment suitable for large vias (approx. 0.5–1 mm)
■solvent-free 1-pack system
■practically no volume shrinkage and no solvent inclusions, thus better process reliability compared to solvent-containing 2-pack systems
■joint curing with solder resists possible
■excellent solder bath resistance, even in lead-free solder processes
■resistant in electroless tin baths
■excellent E-corrosion resistance
■UL Recognised Component: best flame class V-0 acc. to UL94, UL file no. E80315
■tested according to ASTM E595 (outgassing test recognised by NASA)
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Technical Documentation |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/7/5 |
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343 KB |
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