Enterprise Memory (Burn-In Process) Technical Brief
■Burn-in is the process by which Enterprise Memory modules are exercised prior to being placed into the field. Burn-in identifies and forces failure so weak module components are replaced, or that the entire part is replaced. Replacing weak components and/or modules will prevent premature failure, early life mortality failure, or other latent defects which can occur in customer applications.
■Primary failure types are outlined below:
▲Immediate failures: During system startup and testing, failures are removed, which reduces production and administrative delays.
▲Functional failures: Burn-in memory can successfully perform multiple applications, simultaneously, while non burn-in memory can be prone to computational delays. Those failures and delays are reduced, which improves operational efficiency of the systems.
▲Field Failures: Most importantly, reduction of field failures, over the life of the system, diminishes costs and enhances every member’s reputation across the supply chain.
■All memory modules can be made to fail through a sufficiently stringent burn-in process. The key is to establish a proper balance between exercising maximum component thresholds versus how modules are used during normal operating conditions over their service life. The duration of the burn-in test process is important as it needs to be long enough to stress the system and confidently assure manufacturers and customers that every identifiable flaw has been found. By putting these modules through this stress, there should be no problems during deployment.
■Burn-In modules are tested in server motherboards at rated speeds, exercising a node for billions of operations to provoke weaknesses. SMART uses temperature and time to achieve maximum burn-in effectiveness. Custom thermal chambers provide high temperature conditions. Burn-in time is adjusted, depending on the density of the module being tested.
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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03.18.21 |
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Rev.1 |
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508 KB |
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