8020 SERIES Fully Automatic Twin Dicing System
●ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.
●Features and Benefits
■Flexibility-Supports Hub and Hubless blades up to 3”.O.D
■Spindles of 1.8 kW or 2.4 kW high power(for challenging applications)
■Superior vision system with continuous zoom magnification
■Intuitive operation interface using a large 19”touch screen monitor
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[ Silicon wafers ][ discrete devices ][ Silicon carbide ][ SiC ][ MEMS ][ SAW devices ][ Glass wafer ][ LED ] |
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Datasheet |
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Please see the document for details |
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QFN |
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English Chinese Chinese and English Japanese |
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06/20 |
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Ver. 06/20 |
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635 KB |
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