Solder Stencil Design Guidelines for Reliable Assembly of PQFN GaN Devices APPLICATION NOTE

PublishTime：2024-03-08

●In this application note, a set of solder stencil design guidelines are developed and presented for power quad flat no-lead (PQFN) packaged GaN transistors and ICs. Extensive assembly experiments are conducted and followed with physical cross-section analysis, where the measured solder stand-off heights are found to be consistent with the projected values based on the design rules. Such stencil design guidelines enable us to predict the stand-off height with minimum component tilt, yielding the optimal temperature cycling lifetime.
●Introduction
■Power quad flat no-lead (PQFN) packages have become increasingly popular in power electronics. The solder stand-off height of PQFN packages is intrinsically lower than the traditional ball grid array (BGA) packages. Therefore, it is critical to develop a first-principles stencil design rule that yields consistent solder standoff height with minimum die tilt.
■IPC-7525A [1] was the main document used for developing these stencil design guidelines for PQFN devices. By following the design rules, a large number of assembly experiments were conducted and followed with cross-section analysis to quantify the resulting standoff height and component tilt. The cross-sectional results showed consistent planarity of standoff height in all assemblies, validating the effectiveness of stencil designs, and therefore improving thermo-mechanical reliability.

Brand of Product：	EPC
Part#：	EPC23102 、 EPC2302 More Part#
Product Category：	GaN Devices 、 GaN transistors 、 GaN ICs More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	PQFN
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2024/2/24
Version Number：
Data Encoding：	AN029
Data Size：	1.8 MB

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