Solder Stencil Design Guidelines for Reliable Assembly of PQFN GaN Devices APPLICATION NOTE
●Introduction
■Power quad flat no-lead (PQFN) packages have become increasingly popular in power electronics. The solder stand-off height of PQFN packages is intrinsically lower than the traditional ball grid array (BGA) packages. Therefore, it is critical to develop a first-principles stencil design rule that yields consistent solder standoff height with minimum die tilt.
■IPC-7525A [1] was the main document used for developing these stencil design guidelines for PQFN devices. By following the design rules, a large number of assembly experiments were conducted and followed with cross-section analysis to quantify the resulting standoff height and component tilt. The cross-sectional results showed consistent planarity of standoff height in all assemblies, validating the effectiveness of stencil designs, and therefore improving thermo-mechanical reliability.
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Application note & Design Guide |
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Please see the document for details |
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PQFN |
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English Chinese Chinese and English Japanese |
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2024/2/24 |
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AN029 |
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1.8 MB |
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