Bare Die and Wafer Part Numbering & Packing Guide

2024-02-27
●This specification defines the method for bare die packing and part number identification.
■Example: Bipolar Power NPN Darlington Transistor Die, 2N6300, with optional up-screening to MIL-PRF-38534 Class H equivalent, Tray (Waffle) Package.

Central Semiconductor

2N6300CP127-H2N6300-CM

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Bare DieBipolar Power NPN Darlington Transistor Die

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User's Guide

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3-September 2020

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