Chip Device Mounting Instruction Application Note

PublishTime：2024-02-19

■All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with wraparound grounds and/or metal tabs. The wrapped parts use the same metallizations noted above for the ground plane. The tabbed parts are available in a variety of base metals and surface finishes. This application note describes the proper mounting technique for ensuring good RF performance, proper heat sinking, and mechanical support.
■Overview
●Each of the chip types discussed here is designed for a specific mounting application. Table 1 shows the attachment techniques that are recommended for each of the products. The table is organized by termination type. Consult the product description for each specific part to determine which types are available.

Brand of Product：	Smiths Interconnect
Part#：
Product Category：	chip More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2023/8/8
Version Number：
Data Encoding：	AN0005
Data Size：	253 KB

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