HyperRapid NXT SmartCleave High-Speed and High-Quality Brittle Material Processing
●HyperRapid NXT SmartCleave features 1 millijoule burst energy to cut thick substrate in a single pass with sub-micron edge roughness, therefore enabling new applications in the automotive and consumer electronics markets.
●The 50 W average power model is optimal for cost-sensitive applications,while the 100 W version enables high speed applications up to 2 m/s.
●FEATURES & BENEFITS
■1064 nm output
■100 W power to enable high throughput
■Over 1000 μJ burst energy to cut thicker samples
■Specified burst mode operation for repeatable performance in volume manufacturing
■Compact and light weight, same interfacing as standard HyperRapid NXT to allow straightforward integration
■Right of use to the Coherent SmartCleave IP is included
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[ High-Speed and High-Quality Brittle Material ][ glass ][ sapphire ][ ceramics ][ composite materials ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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0720 |
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MC-028-20-0M0720 |
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895 KB |
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