2312061507 EFR32BG27 and EFR32MG27 Datasheet v1.1 Release Bulletin
●Description of Change
■Silicon Labs is pleased to announce the release of datasheet v1.1 for EFR32BG27 and EFR32MG27 devices.
■Please refer to the datasheet revision history for a complete list of changes.
●Reason for Change
■The main changes are a correction of a typical value for DVDD BOD rising threshold, and the Capacitive Sense feature of ACMP has been noted as deprecated. Additionally, description of the CSP top mark has been fixed (BG27 only).
●Kit Identification
■This change is considered a minor change which does not affect form, fit, function, quality, or reliability. The information is being provided as a customer courtesy.
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EFR32BG27 、 EFR32MG27 、 EFR32MG27C140F768IM32-B 、 EFR32MG27C140F768IM32-BR 、 EFR32MG27C230F768IM32-B 、 EFR32MG27C230F768IM32-BR 、 EFR32MG27C140F768IM40-B 、 EFR32MG27C140F768IM40-BR 、 EFR32MG27C230F768IM40-B 、 EFR32MG27C230F768IM40-BR 、 EFR32BG27C140F768IM32-B 、 EFR32BG27C140F768IM32-BR 、 EFR32BG27C230F768IM32-B 、 EFR32BG27C230F768IM32-BR 、 EFR32BG27C320F768GJ39-B 、 EFR32BG27C320F768GJ39-BR 、 EFR32BG27C320MZ087GJ39-B 、 EFR32BG27C320MZ087GJ39-BR 、 EFR32BG27C140F768IM40-B 、 EFR32BG27C140F768IM40-BR 、 EFR32BG27C230F768IM40-B 、 EFR32BG27C230F768IM40-BR |
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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Dec 06, 2023 |
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2312061507;2023-12-06-1507 |
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747 KB |
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Dec 06, 2023 |
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Datasheet v1.1 Release |
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