AS1138 Thermal Characterization Report

2023-11-29
●The AS1138 chip has been characterized in the Kinetic Engineering Lab for thermal performance. Not only has there been an estimation of the IC junction temperature, but a temperature profile for the entire system has also been compiled over a range of power dissipation levels.

Kinetic Technologies

AS1138

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Part#

chip

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Application note & Design Guide

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English Chinese Chinese and English Japanese

November 2017

Revision 1.1

AN022

478 KB

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