Thermal Characterization & QFN Layout Guide: for the AS11xx Product Family
■The Kinetic AS11xx product family of PoE PD1 controllers consist of the AS1113, AS1114 and AS1138. All devices are implemented in a 5mm square Quad Flat-pack, No-lead (QFN) package. In the QFN, the silicon die is mounted on a copper paddle, which is part of a stamped or etched lead frame. The die and lead frame are encapsulated in plastic with conventional transfer molding methods. Rather than having leads extending from the sides, the leads are brought out as exposed pads on the bottom surface of the package. The copper paddle is also exposed, providing both a ground connection and a direct thermal path between the die and the outside surface of the package. This construction provides for a small device footprint and exceptional thermal performance.
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AS11xx 、 AS1113 、 AS1114 、 AS1138 、 AS11xx Family |
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Application note & Design Guide |
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Please see the document for details |
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QFN |
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English Chinese Chinese and English Japanese |
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November 2017 |
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Revision 1.1 |
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AN018 |
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799 KB |
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