COOLSPAN® TECA Film: Thermally and Electrically Conductive Adhesive

PublishTime：2023-11-15

■COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy clad metal backplanes, heat sink coins and RF module housings. The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. COOLSPAN TECA provides both a thermal and electrical conductive bond interface.
■COOLSPAN TECA film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
■Common converting processes include laser, steel rule die (SRD), router, and water jet cutting.
■COOLSPAN TECA film has outstanding chemical resistance, and high temperature performance and will survive lead-free solder processing.
■Features and Benefits:
▲Thermally and Electrically Conductive
▲Bond Interface
▲Supplied on PET carrier
▲Easily converted to pre-forms and easily handled
▲Low flow during pressure cure
▲High bond strength
▲Thermally robust
▲Chemically resistant
▲Lead-free solder compatible

Brand of Product：	ROGERS
Part#：
Product Category：	Thermally & Electrically Conductive Adhesive film 、 TECA film 、 thermosetting, epoxy based, silver filled adhesive film 、 adhesive 、 COOLSPAN® TECA Film 、 COOLSPAN TECA film 、 Silver Filled Epoxy Film More
Application：	[ Post fabrication metal backplane attachment ][ Power amplifier heat sink coin attachment ][ RF circuit board module assembly ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	101623
Version Number：
Data Encoding：	92-169
Data Size：	361 KB

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