COOLSPAN® TECA Film: Thermally and Electrically Conductive Adhesive
■COOLSPAN TECA film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier.
■Common converting processes include laser, steel rule die (SRD), router, and water jet cutting.
■COOLSPAN TECA film has outstanding chemical resistance, and high temperature performance and will survive lead-free solder processing.
■Features and Benefits:
▲Thermally and Electrically Conductive
▲Bond Interface
▲Supplied on PET carrier
▲Easily converted to pre-forms and easily handled
▲Low flow during pressure cure
▲High bond strength
▲Thermally robust
▲Chemically resistant
▲Lead-free solder compatible
Thermally & Electrically Conductive Adhesive film 、 TECA film 、 thermosetting, epoxy based, silver filled adhesive film 、 adhesive 、 COOLSPAN® TECA Film 、 COOLSPAN TECA film 、 Silver Filled Epoxy Film |
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[ Post fabrication metal backplane attachment ][ Power amplifier heat sink coin attachment ][ RF circuit board module assembly ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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101623 |
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361 KB |
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