CBW-Series Bondable Chip Resistors, non-magnetic Datasheet
■Chip Resistors in thick film technology
■AgPd termination for flip chip assembly (face-down; for conductive epoxy assembly or soldering) or
■Gold termination (0402, 0603, 0805) for wire bonding (US/TC; face-up) as well as flip chip (face-down; for conductive epoxy assembly)
■High temperature application up to 200°C possible (CBW-HT)
■No wrap-around
■Bottom side completely insulated; passivation on resistor side from 1206 available
■Non-magnetic
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CBW-Series 、 CBW 0603 100K ±5% TK100 AU 、 CBW 0603 1G ±20% TK1000 、 CBW-HT |
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Datasheet |
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Please see the document for details |
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0402;0603;0805;1206;2010;2512;4020 |
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English Chinese Chinese and English Japanese |
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01-2020 |
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Issue 01-2020 |
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231 KB |
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