Devcon HA0825 Two-component, Silicone free，Gap filling Preliminary Technical Data Sheet
■Devcon HA0825 is a non-silicon two-component curing sealant at room temperature, and has a certain thermal performance, Adhesive performance, also has good detachable performance, easy to repair. Able to be used for silicone sensitive parts of the sealing with thermal bonding.
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
Aug.2021 |
|
|
Rev01 |
|
|
|
|
|
300 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
