MPU-9250 Product Specification

2023-10-23
●Product Overview
■MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis magnetometer from Asahi Kasei Microdevices Corporation. Hence, the MPU-9250 is a 9-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a Digital Motion Processor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade from the MPU6515. With its dedicated I²C sensor bus, the MPU-9250 directly provides complete 9-axis MotionFusion™ output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip MotionFusion™, and runtime calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. MPU-9250 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I²C port.
■MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs, three 16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing the magnetometer outputs. For precision tracking of both fast and slow motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale range of ±4800µT.
■Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I²C and SPI serial interfaces, a VDD operating range of 2.4V to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to VDD.
■Communication with all registers of the device is performed using either I²C at 400kHz or SPI at 1MHz. For applications requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz.
■By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.

TDK InvenSense

MPU-9250

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MotionTracking devicemulti-chip moduleMCM9-axis MotionTracking devicetriple-axis MEMS gyroscope

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Datasheet

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Please see the document for details

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QFN

English Chinese Chinese and English Japanese

06/20/2016

Revision 1.1

PS-MPU-9250A-01

2.3 MB

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