IIM-20670 Datasheet SmartIndustrial™ 6-axis MotionTracking® MEMS Device for Industrial Applications
■The IIM-20670 is a SmartIndustrial™ 6-axis MotionTracking device that combines a 3-axis gyroscope and a 3-axis accelerometer in a small plastic package. By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, InvenSense has driven the package size down to a footprint and thickness of 4.5x4.5x1.1mm3 (24-pin DQFN), to offer fully integrated, high performance component in a compact form factor.
■The IIM-20670 features:
▲Six independent mechanical structures
▲Gyroscope with programmable full scale range from ±41 dps to ±1966 dps
▲Accelerometer with programmable full-scale range from ±2g, to ±65g
▲Two temperature sensors
▲10 MHz Serial Peripheral Interface (SPI)
▲10,000 g shock tolerant structure
▲Low offset and sensitivity variation over temperature
■IIM-20670 includes on-chip 16-bit ADCs, programmable digital filters, and an embedded temperature sensor. The device features an operating voltage range from 5.5V down to 3.0V, and a current consumption below 10 mA in all the operating conditions.
[ Industrial ][ Navigation ][ Platform stabilization ][ Asset Tracking ][ Robotics ][ Industrial automation ][ Smart transportation ][ Agriculture machinery ][ construction machinery ] |
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
DQFN |
|
English Chinese Chinese and English Japanese |
|
05/05/2023 |
|
Revision: 1.0 |
|
DS-000183 |
|
2.9 MB |
- +1 Like
- Add to Favorites
Recommend
- TDK Announces the InvenSense ICP-10125 Waterproof SmartPressure™ Sensor Platform, Achieving the Industry’s Lowest Pressure Noise of 0.4 Pa RMS
- InvenSense® Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms and Huawei Smartphones
- TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors
- InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
- InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
- InvenSense® Announces Contextual Awareness SDK for Embedded Developers and Mobile Devices
- InvenSense And AutoNavi Partner To Provide High-Accuracy, High-Availability Turn-By-Turn Navigation User Experience To Huawei Smartphones
- InvenSense Announces World’s Smallest, Lowest Power I²S Microphone ICS-43434 for IoT and Wearable Markets
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.