UG554: xG27 Dev Kit User's Guide

PublishTime：2023-08-17

●The xG27 Dev Kit is a low-cost, small form factor prototype and development platform for the EFR32BG27 Wireless Gecko System-on-Chip.
●The board is a small and cost-effective, feature-rich, prototype and development platform based on the EFR32™ Wireless Gecko System-on-Chip. The xG27 Dev Kit is an ideal platform for developing energy-friendly connected IoT devices.
●The xG27 Dev Kit ships with a Bluetooth demo that works with a cloud connected smart- phone app, showcasing easy collection of environmental and motion sensor data, as well as button and LED control.
●A built in SEGGER J-Link debugger ensures easy debugging through the USB Micro-B connector.
■TARGET DEVICE
●EFR32 Wireless Gecko System-on-Chip (EFR32BG27C140F768IM40)
●Cortex-M33 w/FPU with 76.8 MHz maximum operating frequency
●512 kB flash and 32 kB RAM
●Energy-efficient radio core with low active and sleep currents
●Bluetooth 5.2 Direction Finding
●Integrated PA with up to 8 dBm (2.4 GHz) TX power
●Secure Boot with Root of Trust and Secure Loader (RTSL)
■KIT FEATURES
●2.4 GHz ceramic chip antenna
●Power control of on-board peripherals for ultra-low-power operation
●Relative humidity and temperature sensor
●Ambient light sensor
●Hall effect sensor
●6-axis inertial sensor
●PDM stereo microphones
●8 Mbit flash for OTA programming and data logging
●User LED and push button
●20-pin 2.54 mm breakout pads
●SEGGER J-Link on-board debugger
●Virtual COM port
●Packet Trace Interface (PTI)
●Mini Simplicity connector for AEM and packet trace using external Silicon Labs debugger
●USB or coin cell battery powered.
■SOFTWARE SUPPORT
●Simplicity Studio™

Brand of Product：	Silicon Labs
Part#：	xG27 、 EFR32BG27 、 EFR32 、 EFR32BG27C140F768IM40 、 BRD2602A 、 xG27-DK2602A More Part#
Product Category：	Dev Kit 、 Wireless Gecko System-on-Chip 、 Dev Kit board 、 wireless MCU More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	June 2023
Version Number：	Revision 1.0
Data Encoding：	UG554
Data Size：	5.1 MB

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