DK-42351 Development Kit for IIM-42351 3-Axis Accelerometer
■The DK-42351 is a comprehensive development platform for IIM-42351, a very low noise 3-axis accelerometer that supports a broad range of applications including tilt sensing.
■The platform, designed around Microchip SAM G55 MCU can be used by developers for rapid evaluation and development of IIM-42351 based solutions. The DK-42351 includes an onboard Embedded Debugger so external tools are not required to program or debug the SAM G55 MCU.
■The development kit comes with necessary software including InvenSense Motion Link, a GUI based development tool and embedded Motion Drivers for IIM-42351.
■Embedded Motion Drivers (eMD) consists of a set of APIs to configure various aspects of the platform including IIM-42351 sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise mode, and sensor interface to host (I²C, SPI).
■MotionLink is a GUI based development tool included with the platform. SmartMotion Release 4.1.19 or higher can be used to capture and visualize the sensor data from the motion sensor.
●Key Features
■IIM-42351 3-axis accelerometer
■Microchip SAM G55 MCU with 512KB Flash
■On-board embedded debugger for programming and debugging
■USB connectors for host interface to support software debug and sensor data logging
■Board power supply through USB
■Accelerometer calibration
■Motion measurements: Tap, Tilt, Freefall, Wake on Motion (WOM) and Signficant Motion Detection (SMD)
|
Development Kit 、 comprehensive development platform 、 3-Axis Accelerometer 、 very low noise 3-axis accelerometer |
|
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2021/4/2 |
|
|
|
|
|
|
|
|
393 KB |
- +1 Like
- Add to Favorites
Recommend
- TDK Announces the InvenSense ICP-10125 Waterproof SmartPressure™ Sensor Platform, Achieving the Industry’s Lowest Pressure Noise of 0.4 Pa RMS
- InvenSense® Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms and Huawei Smartphones
- TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors
- InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
- InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
- InvenSense® Announces Contextual Awareness SDK for Embedded Developers and Mobile Devices
- InvenSense And AutoNavi Partner To Provide High-Accuracy, High-Availability Turn-By-Turn Navigation User Experience To Huawei Smartphones
- InvenSense Announces World’s Smallest, Lowest Power I²S Microphone ICS-43434 for IoT and Wearable Markets
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
