Process Change Notice #1303212 SI52142-A01AGM-Au-to-CuPd-wire-Change-PANASONIC
●Description of Change:
Silicon Laboratories, Inc (Silicon Labs) is pleased to announce the successful qualification of copper-palladium wire in the assembly process ofSI52142-A01AGM/R.
Silicon Laboratories has proactively invested in copper-palladium bond wire process to insulate customers from the impact of escalating gold prices. To date, Silicon Laboratories has been absorbing the rising cost of gold.
UTAC-TH is an existing assembly site and test site for Silicon Labs and is certified and registered to ISO9001, ISO14001, ISO/TS16949 and is a Sony Green Partner. UTAC-TH is part of the UTAC Group.
Qualified Bills-of-Material for the 24QFN
●Reason for Change:
Moveto Copper-Palladiumwire for sustainability and to mitigate increasing gold prices.
●Impact on Form, Fit, Function, Quality, Reliability:
There is no impact on form, fit, function, quality or reliability.
|
|
|
|
|
|
|
PCN/EOL |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
24-QFN |
|
|
English Chinese Chinese and English Japanese |
|
|
3/21/2013 |
|
|
rev AE |
|
|
#1303212 |
|
|
581 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
