MSESD9L5.0ST09
●Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications.
●Specification Features:
■Ultra Low Capacitance 0.5 pF
■Low Clamping Voltage
■Small Body Outline Dimensions:
▲0.039′′ x 0.024′′ (1.00 mm x 0.60 mm)
■Low Body Height: 0.016′′ (0.4 mm)
■Stand-off Voltage: 5 V
■Low Leakage
■Response Time is Typically < 1.0 ns
■IEC61000-4-2 Level 4 ESD Protection
■This is a Pb-Free Device
●Mechanical Characteristics:
■CASE: Void‐free, transfer‐molded, thermosetting plastic
■Epoxy Meets UL 94 V-0
■LEAD FINISH: 100% Matte Sn (Tin)
■MOUNTING POSITION: Any
■QUALIFIED MAX REFLOW TEMPERATURE: 260°C
■Device Meets MSL 1 Requirements
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Datasheet |
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Please see the document for details |
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SOD-923 |
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English Chinese Chinese and English Japanese |
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2022/2/14 |
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2.7 MB |
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