High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030" RFLW 3N
●RFLW series of thin film spiral inductors on quartz are designed for RF circuits that require wire bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Measured S parameter files are also available upon request.
In many RF applications, correct component selection is achieved through experimentation. To help designers during the design process, a sample kit of standard values is available.
Additional values and form factors available upon request.
●FEATURES
■High frequency
■ Wire bond assembly
■ Small size: 0.030" x 0.030" x 0.020"
■ Low DCR, high Q
■ Low parasitic capacitance, high SRF
■Equivalent circuit model enclosed
■ S parameter files available for download
■ Sample kit available
|
RFLW 3N 、 RFLW3N3900C 、 RFLW3N6700C 、 RFLW3N9000C 、 RFLW3N1100B 、 RFLW3N2000B 、 RFLW3N3000B 、 RFLW3N2000BMNT0 |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
17-Sep-13 |
|
|
Revision: 17-Sep-13 |
|
|
61057 |
|
|
360 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
