RFLW 3N 0.030" x 0.030" High Frequency Wire Bondable RF Spiral Inductor
■High frequency
■Wire bond assembly
■Small size: 0.030" x 0.030" x 0.020"
■Low DCR, high Q
■Low parasitic capacitance, high SRF
■Equivalent circuit model enclosed
■S parameter files available for download
■Sample kit available
●RFLW series of thin film spiral inductors on quartz are designed for RF circuits that require wire bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Measured S parameter files are also available upon request.
●In many RF applications, correct component selection is achieved through experimentation. To help designers during the design process, a sample kit of standard values is available.
●Additional values and form factors available upon request.
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RFLW 3N 、 RFLW series 、 RFLW3N3900C 、 RFLW3N6700C 、 RFLW3N9000C 、 RFLW3N1100B 、 RFLW3N2000B 、 RFLW3N3000B 、 RFLW3N2000BMNWS 、 RFLW |
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High Frequency Wire Bondable RF Spiral Inductor 、 thin film spiral inductors |
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[ RF circuits ][ RF choking for DC biasing ][ RF tuning circuits ][ Lumped element filters ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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30-Jan-2020 |
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Revision: 30-Jan-2020 |
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61057 |
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376 KB |
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