Renesas RA Family EK-RA2E2 Example Project Bundle
■This document describes the contents of the Example Project Bundle for the EK-RA2E2 kit. The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E2 kit.
■Flexible Software Package is an optimized software package designed to provide easy to use, scalable, high quality software for embedded system design. The primary goal is to provide lightweight, efficient drivers that meet common use cases in embedded systems. FSP code quality is enforced by peer reviews, automated requirements-based testing, and automated static analysis. FSP provides uniform and intuitive APIs that are well documented. Each module is supported with detailed user documentation including example code. FSP modules can be used on any MCU in the RA family, provided the MCU has any peripherals required by the module. FSP modules can be configured at build-time to optimize the size of the module for the feature set required by the application.
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Software Package 、 kit 、 MCU |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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Jan.10.23 |
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Rev.1.12 |
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R20AN0657EU0112 |
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250 KB |
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