Renesas RA Family EK-RA6M4 Example Project Bundle

PublishTime：2020-11-23

This document describes the contents of the Example Project Bundle for the EK-RA6M4 kit. The Example Projects contained within the bundle provide example code for creating various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M4 kit.
Flexible Software Package is an optimized software package designed to provide easy to use, scalable, high quality software for embedded system design. The primary goal is to provide lightweight, efficient drivers that meet common use cases in embedded systems. FSP code quality is enforced by peer reviews, automated requirements-based testing, and automated static analysis. FSP provides uniform and intuitive APIs that are well documented. Each module is supported with detailed user documentation including example code. FSP modules can be used on any MCU in the RA family, provided the MCU has peripherals required by the module. FSP modules also have build-time configurations that can be used to optimize the size of the module for the feature set required by the application.

Brand of Product：	Renesas
Part#：	RA Family 、 EK-RA6M4 More Part#
Product Category：	MCU More
Application：	More
Data Type：	Application note & Design Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	Oct.02.20
Version Number：	Rev.1.00
Data Encoding：	R20AN0585EU0100
Data Size：	297 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 6 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits