S3A1004V0M S3A2004V0M S3A4004V0M S3A8004V0M S3A1604V0M S3A1004R0M S3A2004R0M S3A4004R0M S3A8004R0M S3A1604R0M 1Mb ~ 16Mb SPI MRAM
2023-02-27
●General Description
■The device is a Spin-Transfer-Torque Magneto-resistive Random Access Memory (STT-MRAM). It features a SPl bus interface, XIP (execute-in-place) functionality, and hardware/software based data protection mechanisms. SPI (Serial Peripheral Interface) is a synchronous serial communication interface with command, address and data signals.
■It requires less pin counts than parallel interface and is easy to be configured on the system. The device is offered in density ranging from 1Mbit to 16Mbit. The device can replace Flash, FRAM or (nv) SRAM with same functionality and non-volatility.
■The device provides various SPI modes to allow options for bandwidth expansion.
■SSPI (Single SPl) modes has single (1) pin for command signals. And user can select an option for how many pin to be allocated to address and data signals among 1 pin, 2 pins or 4 pins.
■DSPI (Dual SPI) modes provides dual (2) pins for command, address and data signals.
■QSPI (Quad SPI) modes provides Quad (4) pins for command, address and data signals.
■The device has nonvolatile register bits-status register, configuration register, serial number register, augmented 256 bytes and protection register for augment bytes. These register bits are required to be set at least once on power-up after high temperature solder reflow process.
■The device is available in small footprint 8-pad WSON and 8-pin SOlC packages. These packages are compatible with similar low-power volatile and non-volatile products.
■The device is offered with Commercial (0℃ to 70℃) and industrial (-40℃ to 85℃) operating temperature range.
■The device is a Spin-Transfer-Torque Magneto-resistive Random Access Memory (STT-MRAM). It features a SPl bus interface, XIP (execute-in-place) functionality, and hardware/software based data protection mechanisms. SPI (Serial Peripheral Interface) is a synchronous serial communication interface with command, address and data signals.
■It requires less pin counts than parallel interface and is easy to be configured on the system. The device is offered in density ranging from 1Mbit to 16Mbit. The device can replace Flash, FRAM or (nv) SRAM with same functionality and non-volatility.
■The device provides various SPI modes to allow options for bandwidth expansion.
■SSPI (Single SPl) modes has single (1) pin for command signals. And user can select an option for how many pin to be allocated to address and data signals among 1 pin, 2 pins or 4 pins.
■DSPI (Dual SPI) modes provides dual (2) pins for command, address and data signals.
■QSPI (Quad SPI) modes provides Quad (4) pins for command, address and data signals.
■The device has nonvolatile register bits-status register, configuration register, serial number register, augmented 256 bytes and protection register for augment bytes. These register bits are required to be set at least once on power-up after high temperature solder reflow process.
■The device is available in small footprint 8-pad WSON and 8-pin SOlC packages. These packages are compatible with similar low-power volatile and non-volatile products.
■The device is offered with Commercial (0℃ to 70℃) and industrial (-40℃ to 85℃) operating temperature range.
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