CPU SOCKET PRODUCT FAMILY LGA 1700 SOCKET-V0
●At present, the interface methods commonly used by CPU are contact type and pin type. By product type can be divided into LGA, PGA and BGA. LGA1700, also known as Socket V0, is used in Intel 12 generation Core product series. The pin arrangement adopts the ' double L ' design. Compared with the previous generation Socket-H, the number of pins of the product increases from 115X-1200 to 1700. In the package, the overall package is changed from square to rectangular, and the size is extended by about 7.5 mm ; in the ball planting process, the use of hot ball planting technology, to ensure that the flatness of the iron plate ≤ 0.20mm, can greatly reduce the false welding defect rate, optimize the chip space layout and strengthen the stability of the chip signal transmission. DEREN is developed directly with Intel as its own brand. It is the only company in the mainland that can independently complete the development and mass production of CPU socket connectors, and is in the top three in the world.
● An array electrode contact package is made on the bottom of the chip, which can accommodate more input and output pins in a smaller package.
● Total number of contacts for LGA 1700, 0.80mm orthogonal.
● Support diverse latch designs to meet customer different application fields.
● This product defines surface mount (Land Grid Array) socket.
Selection catalogue
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Selection guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/12/23 |
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911 KB |
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