CHIP 1206HC Series / 3.2×1.6 mm, High Current Type Surface Mount Fuses
■Materials
◆Body:Cu, Sn
◆Substrate: Alumina ceramic
◆Electrode:Cu, Ni, Sn(Termination with nickel and Pure-tin solder plating)
■Operating Temperature
◆-55℃ to +150℃ (Consider de-rating)
■Solderability
◆T =245℃±5℃, t =5s±0.5s, Cover ≧95%, △S=2.0mm±0.5mm, magnifier: 20X
■Resistance to Soldering Heat
◆T =260℃±5℃, t =10s ±1s
◆△S=2.0mm±0.5mm
■Recommended Soldering Parameters
◆260℃, 10s Max. (Compatible with both wave and Solder-reflow)
■Storage Conditions
◆Can be stored for 2 years under tight seal condition at temperature of +10℃~40℃, relative humidity ≤ 75%.
◆At most can be kept 30 days at temperature +10℃~40℃, relative humidity ≤ 95% under covered conditions.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/10/25 |
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324 KB |
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