CHIP 0603T Series / 1.60×0.80 mm, Time-Lag Type Surface Mount Fuses
■Materials
◆Body：Cu , Sn
◆Substrate：Alumina ceramic
◆Electrode：Cu, Ni, Sn(Termination with nickel and Pure-tin solder plating)
■Operating Temperature
◆-55℃ to +150℃ (Consider de-rating)
■Solderability
◆T=235°C±5°C, t =2+0/-0.5s, Cover≧95%,△S=2.0mm±0.5mm, magnifier: 20X
■Resistance to Soldering Heat
◆T=260℃±5℃, t =10s ±1s
◆△S=2.0mm±0.5mm
■Recommended Soldering Parameters
◆260℃, 10s Max. (Compatible with both wave and Solder-reflow)
■Storage Conditions
◆Can be stored for 3 years under tight seal condition at temperature of +10℃~40℃, relative humidity ≤ 75%.
◆At most can be kept 30 days at temperature +10℃~40℃, relative humidity ≤ 95% under covered conditions.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/10/25 |
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317 KB |
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